Printed Circuit Board Assembly (PCBA)
We offer high-quality PCBA assembly services managed by the latest state-of-the-art MES software, from prototypes to large-scale production. Our services include SMT, THT, and mixed-technology assembly with advanced inspection and testing. We specialize in ensuring flawless solder paste application and seamless integration of PCBAs into final products. Our team of certified technicians guarantees top-quality assemblies that meet the highest industry standards.
Prototyping, Low to High Volume Assembly
Fast and efficient prototyping services to help bring your designs to life, with the capability to scale from low to high volume production runs to meet your ongoing project requirements.
Automated Through-Hole Technology (THT)
Reliable selective solder THT assembly for components requiring strong mechanical bonds, ensuring durability in demanding applications.
Surface Mount Technology (SMT)
High-precision SMT assembly for single and double-sided boards, accommodating a wide range of component sizes and complexities.
Solder Paste Inspection (SPI)
Advanced SPI systems to ensure precise application of solder paste, detecting any issues before components are placed, reducing defects and improving overall quality.
Automated Optical Inspection (AOI)
Advanced AOI systems to ensure accuracy and quality, identifying defects such as missing components, soldering issues, and misalignment
Conformal Coating & Potting
Protective solutions including conformal coating and potting to safeguard your PCBs from environmental factors like moisture, dust, and chemicals.
IPC-A-610 Certified Inspectors
Our team includes IPC-A-610 certified inspectors, ensuring that all assemblies meet the highest industry standards for quality and reliability.
Functional Testing
Comprehensive testing solutions to verify the integrity of your assembled boards, ensuring they meet all performance and reliability standards.
Automated X-Ray Inspection (AXI) / CT Scan
Automated X-Ray Inspection (AXI) system to ensure accuracy and quality, identifying defects within blind terminated solder joints.